Communications - Mobile Handheld Devices Application IC
Chinese Leading Mobile Phone IC Design House Strategies - Spreadtrum
August 16, 2006 / Eric Lin / China Research Team
11 Page, Topical Report

Abstract

Spreadtrum Communications was established in 2001. By 2005, Spreadtrum's innovative GSM/GPRS turnkey solutions had made it China's leading mobile phone IC design house, and the company had also begun to expand into TD-SCDMA mobile phone chip design. This report will examine the current status of Spreadtrum's operations.
  •  List of Topics
  •  List of Figures
  •  List of Tables

Besides the support provided by the Chinese government, one of the key factors behind Spreadtrum's rapid growth was the experience that the company's founders had gained working at mobile phone design houses. This experience, combined with the availability of low-cost R&D resources in China, contributed to Spreadtrum's successful development of baseband chips for GSM/GPRS mobile phones.

With the rapid increase in the number of mobile phone subscribers in China, there is considerable room for further mobile phone sales growth in the economically less developed regions. In these regions, the leading mobile phone brands' distribution networks are less extensive than in developed regions and brand awareness is relatively low. Several Chinese electronics manufacturers and distributors have been exploiting this latent demand by using turnkey solutions to produce low-priced, multi-function "black mobile phones" for sale in rural areas through their own distribution channels.

Spreadtrum has also found customers among China's mobile phone vendors, whose limited R&D capabilities, relatively small size, and lack of bargaining power have pushed them to look for IC suppliers that can provide them with a high level of support.

As a result, Spreadtrum has leveraged its two main sources of competitive advantage - low prices and the ability to provide support and services from close at hand - to secure a substantial share of the two market segments described above. Although its share of the market as a whole is still relatively low, Spreadtrum has already established itself as China's largest mobile phone IC supplier.

Spreadtrum still has several challenges to overcome in the future. One is related to its customer portfolio, and the other is related to the company's product line. On the customer side, as Spreadtrum provides SoC solutions, the mobile phones developed by its various customers using these solutions tend to be rather homogenous. This situation has resulted in an intensification of competition between the companies concerned, which poses a great challenge for Spreadtrum to choose between brands or distributors as its customers.

As regards Spreadtrum's product line, the main cause of concern is the next-generation TD-SCDMA chips. Although the Chinese government has thrown its weight behind the development of TD-SCDMA technology, there is still considerable uncertainty as to how the licenses for TD-SCDMA operators will be issued, how TD-SCDMA will create segmentation between itself and other 3G standards, and how the technology will evolve in the future. These issues will have an impact on subscriber take-up, which in turn may affect the level of demand for TD-SCDMA chips.

Another potential problem is the likelihood of intense competition within the TD-SCDMA mobile phone chip market. There are currently four companies in China that are working on TD-SCDMA chip R&D. Development of TD-SCDMA chips requires close collaboration with the mobile phone vendor to improve product performance. Unfortunately, the mobile phone vendors with which Spreadtrum is collaborating on TD-SCDMA product development have limited R&D and design capabilities, low production capacity, and little influence over how the market develops. This puts Spreadtrum at a disadvantage compared to other mobile phone chip design firms that have the backing of leading international mobile phone vendors, and may have a negative impact on both the speed with which Spreadtrum is able to bring its new TD-SCDMA chips into the market and the market share that the company is able to secure.

Table 3

Chinaese TD-SCDMA Chip Suppliers' Customers

Chip Supplier

Mobile Phone Design House

Mobile Phone Vendor

T3G

Techfaith

Samsung, Philips

Commit

---

LG, Bird

ADI

Simcom

ZTE, TCL, Holley

Spreadtrum

CECW

Bird, Amoisonic, Hisense, Haier

Source: MIC, September 2006

Appendix

List of Companies

Acer Technology Ventures Asia Pacific

 

宏碁技術投資亞太有限公司

ADI

 

 

Amoisonic

 

廈新

Assets Management

 

 

Biel

 

 

Bird

 

波導

Broadcom

 

 

CECW

 

中國賽龍通信

China Merchants & Fortune

 

招商局富鑫

Chongqing Chongyou Information Technology

 

 

Commit

 

 

Haier

 

海爾

Hantro

 

 

Hisense

 

海信

Holley

 

華立

Legend Capital

 

聯想投資

LG

 

 

MobiLink Telecom

 

 

NEA

 

 

Philips

 

 

RFMD

 

 

Samsung

 

 

Simcom

 

 

Skyworks

 

 

SLAB

 

 

Spreadtrum Communication

 

展訊通信

T3G

 

 

TCL

 

 

Techfaith

 

 

Trident Microsystems

 

 

Willtek

 

 

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